BGA ASSEMBLY CAPABILITIES

· State-of-the-art automatic placement of Ceramic BGA, Plastic BGA, MBGA

· Verification of BGA's using real-time HD X-ray inspection system to elimate assembly defects and soldering problems, such as loose soldering, cold soldering, solder balls and paste bridging.

· Removing & Replacing BGA's & MBGA's, minimum 0.35mm pitch, large BGA's (up to 45mm), BGA Rework and Reballing.

SMT ASSEMBLY CAPABILITIES

· Ball Grid Array (BGA)

· Ultra-Fine Ball Grid Array (uBGA)

· Quad Flat Pack No-Lead (QFN)

· Quad Flat Package (QFP)

· Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP)

· Small Chip Packages (Pitch of 0.2 mm)

THROUGH-HOLE ASSEMBLY

· Automated and Manual Through-Hole Assembly

· Thru-hole technology assembly is used to create stronger connections compared to surface mount technology due to the leads running all the way through the circuit board. This assembly type is often chosen for testing and prototyping that require manual component modifications and for applications that require high reliability.

· Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or electromechanical relays that require great strength in support

MIXED ASSEMBLY ADVANTAGES

· Mixed Assembly - Through-Hole, SMT and BGA components are housed on the PCB. Single or double-sided mixed technology, SMT (Surface Mount) and through-hole for PCB assembly. Single or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection

· Option for components that have no surface mount configuration.

· No solder paste used. Custom assembly process to suit the specific requirements of our customers.