Series

Item

Specifications

1

Number of layer

Standard FR4 High TG

1-50 L (>=10 L must use High TG)

2

Product Type

mechanical blind buried hole, thick copper, semiconductor test board

Multi-laminated blind buried hole

laminate for same side≤4 time

HDI

1+N+1, 2+N+2,3+N+3

High Frequency

Rogers series, Taconic series, Arlon series, Nelco series, F4BK, TP series

Mixed lamination

Rogers+FR4

Rigid-flex

≤20L

FPC

≤10L

metal material

copper material, AL material

3

Surface Treatment

Surface Treatment

HAL, HAL/LF, Enig, Immersion Silver, Immersion Tin, OSP, ENIPIG, Plating hard gold,

Gold finger (contain segmented golden finger), Enig+OSP, Enig+gold finger,

Immersion Tin+gold finger, Immersion Silver+gold finger

4

Board thickness

Board thickness

0.2-12.0mm

5

Finished Copper

Thickness

Outer Layers（max）

20OZ

Inner Layers（max）

10OZ

6

Line width/space

Min line width/space

3/3mil